| 加工定制：否 | 品牌：艾科瑞思 | 型号：YX 2000 |
| 自动手动：自动 | 贴片速度：>0.3k粒/小时 | 分辨度：±15 μmmm |
| 喂料器数目：- | 电源： 220 VACV | 重量：800kg |
| 规格：YX 2000 | 是否跨境货源：否 | UPH：>0.7k |
YX 2000 Spec（物联网传感器/摄像头模组微组装）
1. System capability
Xy Placement ±15 μm
Angular Placement ±0.3°
UPH >0.3k (big die size)
>0.7k (small die size)
2. Material Handing Capability
Die Size 1mm to 7mm
Substrate Size Length: 100 mm to 270 mm
Width up to 100 mm
Loading System Magazine Handler
3. Bond Head
Bond Force 30 -250 g
Bonding Method Epoxy
4. Dispensing System
Dual Time-Pressure Dispensing Musashi
5. Wafer Stage
Wafer Size 4-8 inch (Option: 12 inch)
6. Facilities Required
Voltage 220 VAC
Frequency 50 Hz
Compressed Air Min. 5 bar
Flow Rate 250 LPM @ 5 bar
Power Consumption Max.1500W
7. Dimensions
Wight 800 Kg
W x D x H 2200×1500×1800mm
